Microsoft Unveils 2nm Maia 300 AI ASIC, Completing Cloud AI Lineup

Microsoft has introduced its latest in-house AI application-specific integrated circuit (ASIC), the Maia 300, and an accompanying server rack. The compute chiplets for Maia 300 are manufactured using TSMC's advanced N2P process, an enhanced 2nm technology, which is expected to drive a significant server supply-chain boom in 2027 for cloud AI infrastructure.