GlobalFoundries Enters TSMC's CoWoS Ecosystem with $2 Billion Agreement for Advanced Packaging

GlobalFoundries has secured a multiyear manufacturing agreement with TSMC, valued at $2 billion over five years, to expand silicon interposer capacity at its Malta fab in New York. This strategic partnership will support TSMC's Chip-on-Wafer-on-Substrate (CoWoS) advanced-packaging ecosystem, crucial for high-performance AI chips and other advanced computing applications, addressing growing demand for AI infrastructure.