Inari Amertron Boosts Photonics and Advanced Chip Packaging Capacity

Malaysian semiconductor firm Inari Amertron Bhd is expanding its photonics and advanced semiconductor packaging capabilities. This strategic move aims to meet the rising demand for artificial intelligence (AI) infrastructure and data center connectivity. The company plans further equipment and facility investments in FY27, positioning itself to capitalize on photonics as a significant long-term growth opportunity within the evolving tech landscape.