TSMC to Increase Advanced Chip Packaging Prices by Up to 20% Amid Surging AI Demand

Taiwan Semiconductor Manufacturing Co. (TSMC) is reportedly set to raise prices for its advanced chip packaging services, including CoWoS, by as much as 20%. This move is attributed to the escalating demand for AI processors, which is tightening capacity across the semiconductor supply chain. The price hike is expected to impact the cost of advanced AI chips.