TSMC Considers 20% Price Hike for CoWoS Advanced Packaging Amid Tight Capacity

TSMC is reportedly considering a price increase of up to 20% for its CoWoS advanced packaging services. This potential hike, reported on October 28, 2026, is attributed to the surging demand from AI accelerators like Nvidia's Blackwell and upcoming Rubin chips, which are straining packaging and test capacity. Semiconductor equipment lead times have also stretched to as long as eight months, indicating significant supply chain pressures that will likely impact the cost structures for AI accelerators in 2027.