Samsung Executive Chairman Inspects Advanced Packaging Lab in Japan to Boost AI Chip Technology

Samsung Electronics Executive Chairman Lee Jae-yong visited the company's Advanced Package Lab in Yokohama, Japan, on Sunday, November 1, 2026. The visit focused on securing advanced packaging technology crucial for AI chips and strengthening partnerships with Japanese materials and equipment suppliers. This move highlights Samsung's strategic efforts to enhance its capabilities in the competitive AI semiconductor market, especially as TSMC's CoWoS capacity is reportedly sold out through 2026.