Physik Instrumente Unveils Piezo-Based Wafer Chuck for Semiconductor Manufacturing

AI-generated NewsSnap summary based on source reporting.
Published: 2026-11-05
Category: technology
Source: AZoNano
Original source

Physik Instrumente (PI) introduced an active wafer chuck at SEMICON West 2026, using piezo technology to precisely control wafer shape. This innovation aims to compensate for deformation, which is critical for maintaining accuracy in semiconductor processes like inspection and bonding, supporting substrates up to 300 mm. This could enhance manufacturing precision and efficiency.

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