Lips Semiconductor Secures $15M Series B Funding to Boost AI Data Center Chip Development

Chinese silicon carbide (SiC) power module maker Lips Semiconductor has raised US$13.8 million in a Series B funding round, with Shanghai Xinwei Capital as a new investor. The investment will be used to fund research and development for AI data center (AIDC) products and support global expansion. The company reported over 50% year-on-year operating performance growth in the second half of 2026.