Samsung to Invest $30 Billion in Advanced Semiconductor Packaging for AI Chips

Samsung Electronics' planned expansion of its high-bandwidth memory (HBM) chip packaging capacity in Asan, South Korea, is expected to attract approximately $30 billion in additional investment for advanced equipment. This significant investment, starting with 6 trillion won ($4.48 billion) for a new HBM plant, underscores South Korea's strategic push to bolster its semiconductor manufacturing capabilities, particularly for advanced memory chips critical to artificial intelligence infrastructure.