Semiconductor Industry Intensifies Development of Microchannel Cooling for AI Chips

Competition is intensifying in the development of microscopic 'water channels' within chips and packages to address the significant heat generation in artificial intelligence (AI) semiconductors. Companies like TSMC, NVIDIA, and Samsung are advancing microchannel cooling technology, which involves etching hair-thin passages into chips to circulate coolant, as advanced packaging makes external cooling less effective.